UMS was invited to participate to the ARMMS conference in Wyboston Lakes (UK). During the conference, UMS presented a paper on “On Wafer and Package Test with an Industrial Solution for MMIC Components”.
On Wafer and package tests have been evolving during the last years led by high volume markets, function complexity and diversity (bare dies and packages). Software and Hardware developments are key.
Our advanced new test solutions integrate different measurement types: DC, noise, [S] parameters up to 110GHz, power measurements and conversion gain up to 86GHz. We thus benefit from easy and fast data access and our customers from higher flexibility and test time reduction.
This was illustrated by 3 development examples:
A pulsed power test bench: combination of new equipment generation and powerful test software.
E-band test benches for on wafer test (LNA, Multiplier, PA, IQ up and down converters)
Software tools for data analysis and decision making (setup validation, monitoring in real time...)