Our back-end processes have been optimised to minimise delays and shorten the design to solution cycle. Testing, inspection, dicing and picking all take place in our specialist facility in Orsay.

Testing is performed in the controlled environment of a class 10000, 600m² clean room.

Designs are verified (S-parameters, noise, power, DC) up to 110GHz with state of the art measurement systems, which use automatic probes to provide feedback between design and measurement. This process, which is quick and efficient, delivers a complete wafer map.

Reliability assessments are carried out using burn-in and lifetime test equipment.

Visual inspection against agreed selection criteria is automated to improve efficiency and effectiveness.

We offer an optional dicing and picking service. Automated picking integrates with unique device identifiers from manufacture and measurement results from test to ensure that devices meeting required standards can be selected and, if required, packed in GelPak ® boxes.