Home About Us Products Foundry Service Fast Request UMS Plants News/Events Contact Us RSS feed
News/Events > GaAs foundry new offer
GaAs foundry new offer
GaAs foundry new offer : standard molded plastic packaging

UMS is enlarging its GaAs foundry offer with standard molded plastic packaging. This new offer enables single chip low cost plastic encapsulation of your circuits developed on UMS processes with the BCB option.

8 Standard QFN packages from 3x3mm2 to 6x6mm2 are offered. ADS models are available in the associated design kit for packaged MMIC designs.

Minimum order quantity is 100 packages (engineering) and 500 packages in production.

Process flow for foundry packaged devices

Top
Home Careers Site Map Legal Information Reps & Distributor Print this page