UMS is enlarging its GaAs foundry offer with standard molded plastic packaging. This new offer enables single chip low cost plastic encapsulation of your circuits developed on UMS processes with the BCB option.
8 Standard QFN packages from 3x3mm2 to 6x6mm2 are offered. ADS models are available in the associated design kit for packaged MMIC designs.
Minimum order quantity is 100 packages (engineering) and 500 packages in production.