Our Open Foundry allows customers to gather different MMIC designs on a single wafer in order to:
Shared Foundry is a minimum service, cost saving foundry approach. Participants have free access to design kits and receive 20 diced & untested dies in Gelpak®. Leadtime is 16 weeks.
The possible die dimensions are: 1; 1.4; 2.4; 3.4; 4mm with max aspect ratio 1:3
The possible die dimensions are: 1.4; 2; 2.4; 3.4; 4; 4.4mm with max aspect ratio 1:3
The possible die dimensions are: 1.4; 2; 2.4; 3.4
UMS shared foundry runs offer regular Multi Project Wafer runs with infomration 6 months notice before tape-out.
Next low-medium power process runs
Next High Power Process runs
Next Schottky diode process runs
Next MESFET process run:
Next MESFET process runs
Shared runs are scheduled based on customer needs. UMS optimize schedule to meet tape-out date that maximize delivery time agreement with customers.
Terms and condition: see UMS general and specific conditions of sales
Please contact your local UMS representative for shared run information or send an e-mail to email@example.com