UMS is glad to announce the launch of a new process. The ULRC process increases the available process wide portfolio proposed by UMS.
ULRC is a pure passive and low cost process on 4” GaAs substrate offering very low losses and allowing High-Q passive elements due to high dielectric constant. The ULRC process includes MIM capacitor, two layer metal, thin metallic film resistors (30Ohms/sq and 1000Ohms/sq). Our associated ADS2011 PDK includes all passive devices: capacitors, inductors, resistors, lines and via-holes through the substrate. Targeted applications are: high-Q passive circuits, matching circuits, phase shifter, baluns, filters,.