Shared foundry runs

Shared foundry runs or Multi-Project Wafers are a cost effective foundry approach well suited for Institutes, Labs, Research Centers and Universities. This service allows different customer projects on a single wafer.

You will be able to:

  • Try new designs with high performance processes at limited cost
  • Design MMICs not available on the market place with perfect system fit & cost savings
  • Ensure business protection with secured IP & product exclusivity

Participants have free access to Design Kits.  20 diced & untested MMICs in Gel-Pak® box will eventually be delivered.

The possible die length and width, including dicing streets, are:

For high power processes PPH25X, PPH15X:

  • 1.4mm
  • 2mm
  • 2.4mm
  • 3.4mm
  • 4mm
  • 4.4mm

with maximum aspect ratio 1:3

For Low noise and multi-purpose processes PH25, PH15, PH10, PPH25, HB20M, HP07, BES

  • 1mm
  • 1.4mm
  • 2.4mm
  • 3.4mm
  • 4mm

with maximum aspect ratio 1:3

For passive proces ULRC

  • 1.4mm
  • 2mm
  • 2.4mm
  • 3.4mm

 

Price is determined according to die area and process.

 

Next MPW runs

UMS shared foundry runs offer regular Multi Project Wafer runs with information 6 months notice before tape-out.

Shared foundry runs 2018

Shared foundry runs 2018 planning

 Next low-medium power process runs

Next High Power Process runs:

Next Schottky diode process runs

Next MESFET process runs

Condition of sales

Shared runs are scheduled based on customer needs. UMS optimize schedule to meet tape-out date that maximize delivery time agreement with customers.